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High-performance wafer and mask breaking device "AMC Series"

Easily create cross-sectional observation samples for SEM! Marking is possible with a positional accuracy of ±2.5μm.

The high-performance wafer and mask breaking device "AMC Series" is designed to easily create cross-sectional samples for SEM observation using tungsten carbide rollers. The processing process involves teaching the scribing position while watching the monitor, and automatically starting the scribing. The observation section is automatically skipped, and the internal stress from the scribing is utilized to break the sample. The samples are cut out to be insertable into electron microscope sample holders, etc. The "AMC Series" allows for the quick and precise creation of cross-sectional samples. 【Features】 ■ Scribing with a minimum positional accuracy of ±2.5μm is possible ■ A breaking method utilizing the stress from scribing is adopted ■ Samples with clean cross-sections can be produced ■ Continuous setting of scribing pressure ■ Scribing is possible at a constant pressure even for curved samples *For more details, please refer to the PDF document or feel free to contact us.

  • Semiconductor inspection/test equipment
  • Microscope
  • Other processing machines

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